The semiconductor memory industry is about to go through a period of major technological changes as new integration trends and disruptive packaging technologies pave the way to the future growth of this industry. Historically, the DRAM memory market has been mostly driven by computing applications while NOR Flash has been 
mainly deployed into consumer and communication devices. More recently, NAND Flash memory has emerged as the most promising solid state storage solution for current consumer devices and is showing as the best candidate for hard disk drive replacement in the near future. Integration is the next challenge On the other hand, today wireless is growing and enabling new market segments everywhere, (smart-phones, mobile pocket computing devices). As a result, CONNECTIVIY and INTEGRATION are now new drivers to deal with. Demand for data is increasing everywhere: Faster pipes, more pipes (WAN, LAN, PAN), HD multimedia. Current complexity and concurrency require more than ever higher data capacity, improved power consumption and is stressing existing well established architectures: new interconnects, integration schemes and packaging technologies are needed to support higher performance, breakthrough density and low power consumption devices. 3-D IC integration is showing as a major solution path to tackle these challenges and memories will be key components in achieving this successful integration.
For further details visit as : http://www.live-pr.com/en/new-report-just-published-memory-applications-r1048313266.htm
mainly deployed into consumer and communication devices. More recently, NAND Flash memory has emerged as the most promising solid state storage solution for current consumer devices and is showing as the best candidate for hard disk drive replacement in the near future. Integration is the next challenge On the other hand, today wireless is growing and enabling new market segments everywhere, (smart-phones, mobile pocket computing devices). As a result, CONNECTIVIY and INTEGRATION are now new drivers to deal with. Demand for data is increasing everywhere: Faster pipes, more pipes (WAN, LAN, PAN), HD multimedia. Current complexity and concurrency require more than ever higher data capacity, improved power consumption and is stressing existing well established architectures: new interconnects, integration schemes and packaging technologies are needed to support higher performance, breakthrough density and low power consumption devices. 3-D IC integration is showing as a major solution path to tackle these challenges and memories will be key components in achieving this successful integration.For further details visit as : http://www.live-pr.com/en/new-report-just-published-memory-applications-r1048313266.htm
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